Company Avg OEE
83.5%
Target: 85%+
Avg Yield Rate
89.2%
Industry competitive
Annual Revenue
$4.2B
12,400 employees
Critical Alerts
8
Require immediate attention
Total Capacity
403K
wafers/month (fab plants)
Energy Efficiency
+11%
Above baseline (optimize)
Improvement Potential
$22M+
Annual savings identified
Overall Equipment Effectiveness (OEE)
Target: 85%+ (World-class: 90%+)
90%+ Excellent
85-90% Good
75-85% Warning
<75% Critical
Yield Rate by Plant
Product quality and manufacturing efficiency
Priority: P04 HBM3 yield at 82.1% vs 90% target. $124M/quarter revenue at risk. Immediate action required on TSV alignment and microbump defects.
Top 3 Performing Plants
NSC-P02 (Icheon - DDR4 DRAM)
Top PerformerOEE
91.4%
Yield
94.7%
Throughput
2,412 wafers/day
Exceeds throughput target
Lowest defect density
Minimal downtime
Best cycle time
NSC-P09 (Gimhae - Test & Packaging)
ExcellentOEE
90.2%
Yield
99.2%
Throughput
4.2M units tested/day
99.94% test coverage
High packaging yield
Fast test time
Efficient operations
NSC-P08 (Asan - Specialty Memory)
ExcellentOEE
88.7%
Yield
93.8%
Throughput
924 wafers/day
Best-in-class quality
On target cycle time
Energy efficient
Zero safety incidents